Technical Program Manager, SoC Development – TeraWave

## Application close date Applications will be accepted on an ongoing basis until the requisition is closed. At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion.

Join our team of problem solvers as we add new chapters to the history of spaceflight! Blue Origin is pioneering the future of space-based communications with TeraWave, a revolutionary satellite communications network designed to deliver symmetrical data speeds of up to 6 Tbps anywhere on Earth.

This multi-orbit constellation will consist of optically interconnected satellites in low Earth orbit (LEO) and medium Earth orbit (MEO), providing enterprise-grade connectivity for critical operations worldwide. - Blue Origin is seeking a Senior or Principal Technical Program Manager to lead the development and execution of advanced system-on-chip SoC programs for TeraWave digital beamforming applications.

These highly integrated devices include complex analog/mixed-signal, RF-adjacent, and digital designs , as well as third-party IP blocks, and will support high-performance satellite communications and beamforming systems. This role will own program execution from early requirements definition through architecture, design execution, tapeout , silicon bring-up, qualification, OSAT engagement, and production transition.

The ideal candidate combines formal technical program management discipline with enough IC design and/or satellite communications system knowledge to effectively drive cross-functional technical teams, manage dependencies, identify risks, and align internal and external partners to deliver hardware on schedule.

Key Responsibilities Lead end-to-end technical program execution for TeraWave SoC/IC developments targeting digital beamforming and satcom applications . - Drive planning and coordination across all development phases, including: - Market/product requirements definition - MRD / SRD / system requirements alignment - Architecture and implementation planning - IP selection and integration planning - Analog/mixed-signal and digital design execution - Verification, validation, and DFT readiness - Tapeout planning and signoff readiness - Silicon bring -up - Characterization and qualification - OSAT selection, packaging, test, and production ramp - Establish and maintain integrated program schedules, milestones, deliverables, dependencies, risk registers, and execution dashboards. - Coordinate cross-functional teams including IC architecture, analog/mixed-signal design, digital design, verification, physical design, systems engineering, hardware, software/firmware, supply chain, quality, manufacturing, and operations. - Align third-party IP deliverables with the overall SoC program, including licensing milestones, integration schedules, verification collateral, documentation, support models, and risk mitigation plans. - Identify , evaluate, and coordinate with OSAT partners for packaging, assembly, test, qualification, yield improvement, and production readiness. - Partner with engineering leads to ensure technical readiness at major program gates, including architecture reviews, design reviews, tapeout readiness reviews, bring-up readiness reviews, qualification reviews, and production readiness reviews. - Manage critical path execution and proactively resolve schedule, resource, technical, supplier, and operational risks. - Translate technical complexity into clear executive-level reporting, including status, risks, decisions needed, and mitigation plans. - Ensure alignment between IC deliverables and higher-level TeraWave system objectives , including performance, power, cost, manufacturability, quality, reliability, and schedule. - Drive disciplined change management for requirements, scope, design assumptions, supplier commitments, and production plans. - Support build-versus-buy, supplier strategy, IP strategy, packaging strategy, and test strategy decisions. - Foster a culture of accountability, ownership, technical excellence, and rapid but disciplined execution. ## Minimum Qualifications - Bachelor’s degree in Electrical Engineering , Computer Engineering, Systems Engineering, Physics, or a related technical discipline. - 7+ years of formal experience in technical program management , engineering program management, or equivalent technical leadership roles. - Demonstrated experience managing complex hardware, semiconductor, aerospace, satcom, RF, digital communications, or high-reliability technology programs. - Working technical knowledge of at least one of the following: - IC / SoC development lifecycle - Analog/mixed-signal IC design - Digital ASIC/SoC design - RF or beamforming systems - Satellite communications systems - Advanced packaging, silicon qualification, or production test - Experience managing programs across multiple lifecycle phases, from requirements and architecture through development, validation, qualification, and production. - Experience building and maintaining integrated schedules, risk registers, dependency maps, milestone plans, and executive-level program reporting. - Ability to work effectively with highly technical engineering teams and translate between detailed technical execution and program/business objectives . - Strong communication , decision-making, stakeholder management, and cross-functional leadership skills. - Ability to manage external partners, vendors, suppliers, or IP providers. - Must be a U.S. person as defined by applicable export control regulations, if required for the role. ## Preferred Qualifications - Master’s degree or higher in Electrical Engineering, Computer Engineering, Systems Engineering, or a related field. - 10+ years of technical program management experience for Principal-level consideration. - Direct experience leading semiconductor programs through tapeout , silicon bring-up, qualification, and production ramp . - Experience with complex SoCs containing analog/mixed-signal blocks, high-speed data converters, PLLs, SerDes, DSP engines, embedded processors, memory interfaces, or custom digital accelerators. - Experience with digital beamforming, phased arrays, SATCOM payloads, RF front ends, modems, or space-based communication systems . - Familiarity with semiconductor development flows, including design specification, RTL, verification, DFT, synthesis, place and route, timing closure, signoff, mask generation, tapeout , packaging, test, and yield learning. - Experience coordinating third-party IP integration, including commercial IP, hard macros, PHYs, processors, memory IP, security IP, or EDA/vendor deliverables. - Experience selecting and managing OSATs , packaging vendors, ATE partners, and semiconductor supply-chain partners. - Familiarity with package technologies such as flip-chip, BGA, wafer-level packaging, MCM, 2.5D/3D integration, or advanced thermal/mechanical packaging approaches. - Knowledge of qualification and reliability standards relevant to aerospace, defense, space, or high-reliability semiconductor products. - PMP, PgMP , Agile, Lean, Six Sigma, or equivalent formal program management training/certification. - Experience in fast-paced startup-like environments or new product introduction programs within larger organizations. ## Base Pay Range for CA applicants is $230,398.00 - $322,556.85 ## Culture Statement Don’t meet all desired requirements?

Studies have shown that some people are less likely to apply to jobs unless they meet every single desired qualification. At Blue Origin, we are dedicated to building an authentic workplace, so if you’re excited about this role but your past experience doesn’t align perfectly with every desired qualification in the job description, we encourage you to apply anyway.

You may be just the right candidate for this or other roles. ## Export Control Regulat